IMPROVEMENT OF ADHESIVENESS OF RESIN TO COPPER SURFACE AND ADHESIVENESS IMPROVER

摘要

PROBLEM TO BE SOLVED: To improve the adhesiveness of a copper surface to the resin of prepreg or the like while keeping the copper surface smooth. SOLUTION: A copper coating is dipped in a sulfur-contg. compd. soln. contg. one or more selected from a sulfurized inorg. compd., thiosulfuric acid or its salt thiocyanic acid or its salt and a sulfurized org. compd. to improve the adhesiveness of the copper surface to a resin. The adhesiveness improver contains one or more sulfur-contg. compds. selected from a sulfurized inorg. compd., thiosulfuric acid or its salt, thiocyanic acid or its salt and a sulfurized org. compd. as effective components.