| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly reliable thermal head wherewith satisfactory prints without density nonuniformity can be formed with temperature distribution at an aluminum substrate made uniform. SOLUTION: A thermal head is constructed in a structure wherein pores 1a are formed at an aluminum substrate 1 having a heating resistor and an electroconductive layer 4b, and while driver IC's 5 each having a terminal electrode at its upside are buried in the pores, a space between the side of the driver IC and the wall surface of the pore is filled with epoxy resin 6 and furthermore, the electroconductive layer 4b and the terminal electrode are electrically connected with one end of the electroconductive layer 4b extended up to the upside of the terminal electrode. In this case, 60-90 wt.% of silica filler 7 is included in the upper area of the epoxy resin 6 and 60-90 wt.% of aluminum filler 8 is included in the lower area of the epoxy resin.
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