发明名称 |
Apparatus for spin coating, a method for spin coating and a method for manufacturing semiconductor device |
摘要 |
The invention relates to an apparatus for spin coating for forming a resist film, an SOG film, a polyimide film, and the like in manufacturing semiconductor devices and has the object of forming a coated film with a specified and uniform thickness even in case that an amount of discharged coating solution is a little. An apparatus for spin coating of the invention comprises a rotatable table for placing a wafer, a coating solution discharging means which is set above the rotatable table and discharges a coating solution on the surface of the wafer, and a solvent discharging means which is above the rotatable table and discharges a solvent capable of dissolving the coating solution.
|
申请公布号 |
US6033728(A) |
申请公布日期 |
2000.03.07 |
申请号 |
US19960625675 |
申请日期 |
1996.04.03 |
申请人 |
FUJITSU LIMITED |
发明人 |
KIKUCHI, KENJI;MURAMATSU, TOMOAKI |
分类号 |
B05C5/00;B05C11/08;B05D1/40;G03F7/16;H01L21/027;H01L21/312;(IPC1-7):B05D3/12;H01L21/469 |
主分类号 |
B05C5/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|