Power supply distribution structure for integrated circuit chip modules

摘要

A power distribution structure for a multichip module including, a base plate, a plurality of mesas arranged in a pattern are formed on the base plate, the mesas having electrically conductive upper surfaces which lie substantially in a single plane. A thin, conformal dielectric layer is formed over the exposed side surfaces of the mesas and the exposed surfaces of the support base and a conductive material is deposited over the dielectric material filling the area between and surrounding the mesas. The upper surfaces of the mesas and the upper surface of the conductive material surrounding the mesas lie in substantially one plane and are electrically isolated from each other by the dielectric material. A multilayered thin film structure for a multichip module may be formed over the power distribution structure and power and ground potentials supplied to microelectronic components, such as integrated circuit chips, mounted on the surface of the thin film structure using vias routed through the thin film structure.