| 摘要 |
PURPOSE: A molding apparatus for semiconductor package mold is provided to prevent a fail due to an incline of a plunger plate by moving the plunger plate up and down with maintaining horizontality. CONSTITUTION: The molding apparatus comprises a base(2), a cavity block(4, 6) formed on the base(2), in which a plural cavity(8) and resin supplying port(10) are formed, a plunger(12) formed in the resin supplying port(10), a plunger plate(14) formed between the base(2) and the cavity block(4, 6) for moving up and down, on which the plunger(12) is connected with, a cylinder(16) for moving up and down the plunger plate(14), a plural link(24, 26) for connecting the base(2) and the plunger(12), and a connection rod(28) for clutching identically each link(24, 26).
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