发明名称 |
Resin/copper/metal laminate and method of producing same |
摘要 |
A laminate for use in production of printed circuit boards comprising a metal layer having a first side and a second side; a metallic substrate, one side of the metallic substrate being attached to the first side of the metal foil; an adhesive substrate formed of a polymeric material having a first surface and a second surface, the first surface being attached to the second side of the copper foil, the adhesive substrate being at least partially uncured; and a releasable protective film along the second surface of the adhesive substrate. |
申请公布号 |
AU4866999(A) |
申请公布日期 |
2000.03.06 |
申请号 |
AU19990048669 |
申请日期 |
1999.07.08 |
申请人 |
GA-TEK INC. (DBA GOULD ELECTRONICS INC.) |
发明人 |
R. RICHARD STEINER;SHIUH-KAO CHIANG |
分类号 |
B32B15/01;B32B15/08;B32B37/20;C09J7/00;C09J7/02;C09J201/00;H05K1/05;H05K1/09;H05K3/00;H05K3/02;H05K3/38;H05K3/44;H05K3/46 |
主分类号 |
B32B15/01 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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