CHIP SIZE PACKAGE METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT

摘要

PURPOSE: A chip size package(CSP) method of semiconductor integrated circuit(IC) is provided to use a chip size package having various density in the same board by separating all lead beam and frame of a ball array including a not-contact(NC) ball. CONSTITUTION: The semiconductor IC comprises a ball array including a plural ball connected with a device pad and n-numbered NC balls not connected with the device pad, and a beam lead connecting with a frame chassis and connected with each ball of the ball array. In the CSP method, the corresponding beam lead of plural ball connected with the device pad is separated from the frame when the beam lead is bonded with the device pad. The beam lead correspond to the NC ball is separated from the frame by cutting for the frame portion correspond to the NC ball to be protruded outside when the beam lead is cut for separating.