| 摘要 |
PURPOSE: A conduction ball fixing device in semiconductor packaging is provided to reduce a cost of production for maintaining a clean room and improve a rate of production. CONSTITUTION: The conduction ball fixing device in semiconductor packaging comprises a container, and a chamber. In the conduction ball fixing device, the container contains a plurality of boards in a predetermined step, wherein the board has a plurality of conduction balls which are placed contact point of conduction ball by a flux. The container also transforms a heat energy to the board through opened side. The chamber equips the container and makes an atmosphere of gas and supplies the heat energy to attach the conduction ball to the contact point of conduction ball.
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