| 摘要 |
PROBLEM TO BE SOLVED: To provide the IC card which can protect an IC chip mounted in the IC card against external environment such as temperature and humidity while protecting it against spot depression and external mechanical pressure by bending. SOLUTION: After flip chip(IC chip) mounting for mounting the IC chip 8 directly on a circuit board film 7, one layer of sealing resin 10 with high hardness as a sealant is provided and further the chip is sealed from above with rubber-based sealing resin 11 having a low modulus of bending elasticity; and a rubber-based sealing resin layer 12 with a low modulus of bending elasticity is provided as a core on the opposite surface of the circuit board film 7, thus constituting the IC card. |
