发明名称 CIRCUIT SUBSTRATE-HOUSING STRUCTURE FOR THERMOELECTRIC MODULE TYPE ELECTRIC REFRIGERATOR
摘要 PROBLEM TO BE SOLVED: To improve safety property by a method wherein a recessed part is formed at the outside of a main body chamber and a circuit substrate, controlling electronically a heat radiating side pipeline circuit and a cooling side pipeline circuit is attached to the side wall of the recessed part to prevent the circuit substrate from being wetted by water, fallen from the upper part of a refrigerator main body, without providing any waterproofing cover. SOLUTION: In a thermoelectric module type electric refrigerator provided with a heat radiating side pipeline circuit and a cooling side pipeline circuit through a heat exchanging unit accommodating a thermoelectric module 2, a heat exchanger 14, a fan 22 attached above the heat exchanger 14, a pump 16 and a tank 38 among the constituting elements of the heat radiating side pipeline circuit are arranged so as to be housed in a recessed part 46 formed at the rear and lower part of a refrigerator main body 26. Further, a recessed part 64 is formed above the outside recessed part 46 to house almost all (the heat exchanger, the pump and the like) of the constituting elements of a cooling side pipeline circuit in the recessed part 64 while the cooling side pipeline circuit is partitioned from a storage chamber through a partitioning plate 66. According to this constitution, a waterproofing cover is not necessitated and the simplification of the structure can be attained.
申请公布号 JP2000065468(A) 申请公布日期 2000.03.03
申请号 JP19980231683 申请日期 1998.08.18
申请人 MATSUSHITA REFRIG CO LTD 发明人 NAKAGAWA AKIRA;KUWAJIMA KATSUYUKI
分类号 F25D11/00;F25D29/00;(IPC1-7):F25D29/00 主分类号 F25D11/00
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