发明名称 PACKAGING METHOD IN HYBRID INTEGRATED CIRCUIT
摘要 PROBLEM TO BE SOLVED: To check the suction of a liquid synthetic resin caused by capillarity into a space between the underside of a frame plate and the upper surface of a printed board by providing a groove in the underside of the frame plate extending along the entire inner periphery of an opening. SOLUTION: An opening 14 through which various electronic components 12 are set is formed in a frame plate 13, and a groove 13a is arranged in the underside of the plate 11, the groove 13a extending along the entire inner peripheral surface of the opening 14. Therefore, until a liquid synthetic resin charged into the opening 14 in the plate 13 is cured, the grove 13a stops the suction by capillarity of part of the synthetic resin into a space between the underside of the plate 13 and the upper surface of a printed board 11 from the entire periphery of the opening 14 by exposing the synthetic resin to the atmosphere, and hence such absorption can be reliably checked. As a result, it does not occur that the frame body cannot be separated after packaging, and the shape after packaging can be stabilized.
申请公布号 JP2000068302(A) 申请公布日期 2000.03.03
申请号 JP19980238744 申请日期 1998.08.25
申请人 ROHM CO LTD 发明人 INOUE TANEICHI;MATSUYAMA SHIGEO
分类号 H01L23/28;H01L21/56;(IPC1-7):H01L21/56 主分类号 H01L23/28
代理机构 代理人
主权项
地址
您可能感兴趣的专利