PRE-SOLDERING APPARATUS FOR IC'S LEADS,申请号KR19970028383U-传众专利搜索

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发明名称	PRE-SOLDERING APPARATUS FOR IC'S LEADS
摘要
申请公布号	KR200173028(Y1)	申请公布日期	2000.03.02
申请号	KR19970028383U	申请日期	1997.10.13
申请人	SAMSUNG ELECTRONICS CO, LTD.	发明人	SUKUE, MASAHARU;WOO, BYUNG-WOO;KIM, CHOUL-SU
分类号	H01L21/60;(IPC1-7):H01L21/60	主分类号	H01L21/60
代理机构		代理人
主权项
地址

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