METHOD AND DEVICE FOR APPLYING IC SEALANT WITH BUMP

摘要

A method and a device for applying an IC sealant with a bump capable of solving a cobwebbing problem at a rise of a dispense nozzle after sealant application and implementing a productivity improvement; specifically, a method and a device for applying an IC sealant with a bump, wherein a dispense nozzle (12) is raised in a first stage (E) at low speed simultaneously with the stop of dispensing until the first stage (E) covers a specified height and then it is raised in a second stage (F) at high speed. The above design, in which the dispense nozzle (12) is raised in the first stage (E) at low speed after the application of the sealant (2) and the nozzle (12) is then raised at high speed and in a short time in the second stage (F), can positively cut off the sealant (2) without inducing cobwebbing and enhance productivity.