Method for fabricating a thin film resistor onto a ceramic-polymer substrate

摘要

A method of fabricating a thin film resistor onto a ceramic-polymer substrate (22) includes lapping (12) the surface of the ceramic-polymer substrate (22) until the surface roughness falls in a range between 10 to 40 microinches. The ceramic-polymer substrate (22) is then sputtered with a resistive material from a target (20) positioned within a predetermined distance away from the substrate (22) to deposit a thin film resistor layer (54) over the substrate (22). The predetermined distance is one-half of the diameter of the target (20). Preferably, the thin film resistor layer consists of tantalum nitride. <IMAGE>