| 摘要 |
A pressure sensitive adhesive double coated sheet comprises a shrink substrate and, superimposed on both sides thereof, pressure sensitive adhesive layers, at least one of which is an energy radiation curable pressure sensitive adhesive. The pressure sensitive adhesive double coated sheet is used to fix a semiconductor wafer temporarily to a hard support plate whilst the back surface of the wafer is ground and/or the wafer is diced into chips. The adhesive is irradiated to cure it and shrink the substrate so that the wafer can be removed. The shrink substrate may have a multiplicity of minute cuts. |
