| 摘要 |
PROBLEM TO BE SOLVED: To prevent the transference of wetting of an index table to a supplying portion by delivering wafers without generating a contact of a manipulator for taking out the wafers from the supplying portion with a handling mechanism. SOLUTION: A wafer to be taken out of a load cassette of a supplying portion is placed on yoked tips 101 and a root 102 of a manipulator. The wafer taken out is held at narrow parts in both sides of the tip of the manipulator by both projecting pieces 70, 70 of a rotary handle 66 of a handling mechanism projected in the horizontal direction. With this structure, contact of the manipulator with the projecting pieces 70 is prevented. Consequently, even in the case where the handling mechanism is wet, wetting of the supplying portion due to the transference of wetting to the manipulator is prevented. Thereafter, the turn over hand 66 held the wafer is moved onto an index table, and the projecting pieces 70, 70 are turned at 180 degree in a direction Z so as to turn over the wafer, and the wafer is placed on a top surface of a load buffer on the index table. |
