| 发明名称 |
Electronic component |
| 摘要 |
The invention relates to an electronic component manufactured in thick film technology, thin film technology or silicon technology and then provided with an electrically insulating layer which is covered by an amorphous metal layer. The amorphous metal layer protects the component, even with the smallest of layer thicknesses, from external influences and directly transmits heating and force effects.
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| 申请公布号 |
US6030709(A) |
申请公布日期 |
2000.02.29 |
| 申请号 |
US19970837265 |
申请日期 |
1997.04.11 |
| 申请人 |
GRUNDFOS A/S |
发明人 |
JENSEN, NIELS DUE;BROWN, TINA ROMEDAHL;DYRBYE, KARSTEN;ANDERSEN, PER ELLEMOSE |
| 分类号 |
C23C28/00;C23C30/00;G01D5/14;G01F1/684;G01K7/01;G01L9/00;G01L19/06;(IPC1-7):B32B9/04;B32B15/00;H01L29/12;H01C3/04 |
主分类号 |
C23C28/00 |
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