发明名称 OUTER THERMAL INSULATION PANEL FOR RESIDENCE STRUCTURAL FRAME
摘要 PROBLEM TO BE SOLVED: To further improve thermal insulation performance in an outer thermal insulation structure applying thermal insulation means on an outer side of a structural frame of residence. SOLUTION: A groove 1a for receiving a structural member 10 and a step difference part 1b are formed in a recessed manner by matching with a position of the structural member 10 of a structural frame B on a rear surface of a thermal insulation panel A made of foaming resin of an outer thermal insulation structure. A projecting part 2 protruding on a rear surface side is formed between the groove 1a and the step difference part 1b, an the thermal insulation panel A is stuck to the structural frame B so that the projecting part 2 of the thermal insulation panel A is fitted into a space of the structural member 10 so as to prevent dew condensation in a wall and ensure a high degree of thermal insulation performance.
申请公布号 JP2000064447(A) 申请公布日期 2000.02.29
申请号 JP19980249163 申请日期 1998.08.19
申请人 OMIYA KENJI 发明人 OMIYA KENJI
分类号 E04B1/64;B32B5/18;E04B1/76;E04B1/80;E04B2/56;E04F13/08;E04F13/24;(IPC1-7):E04B1/76 主分类号 E04B1/64
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