发明名称 Insulated surface mount circuit board construction
摘要 A multilayer circuit board or laminated circuit board includes an insulated mounting area for a surface mount package. The mounting area is provided in a recess or portion of the circuit board where the circuit board is only a single layer thick. The insulated mounting area is provided in a blind via in the multilayer circuit board. The insulating medium associated with the single layer provides a heat conductive yet highly electrically insulative mounting area for a heat sink. The heat sink may be mounted on a side opposite the electrical device. The heat sink may be a standard heat sink or a copper coil directly soldered to the circuit board. The heat sink mounting advantageously eliminates the need for bolts, nuts, brackets, and an additional insulating layer necessary to insulate power semiconductor components.
申请公布号 US6029343(A) 申请公布日期 2000.02.29
申请号 US19970907031 申请日期 1997.08.06
申请人 ALLEN-BRADLEY COMPANY, LLC 发明人 WIELOCH, CHRISTOPHER J.
分类号 H01L23/36;H01L23/367;H01L23/538;H05K1/18;H05K7/20;(IPC1-7):H05K3/36;H05K3/34;H05K3/00 主分类号 H01L23/36
代理机构 代理人
主权项
地址