| 发明名称 |
Apparatus and methods for recirculating chemical-mechanical polishing of semiconductor wafers |
| 摘要 |
An apparatus and method for polishing the surface of a semiconductor wafer is provided in which the polishing pad has on its surface a multiplicity of nanoasperities which contact the wafer surface in combination with a reactive liquid solution free from particulate matter.
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| 申请公布号 |
US6030899(A) |
申请公布日期 |
2000.02.29 |
| 申请号 |
US19990363540 |
申请日期 |
1999.07.29 |
| 申请人 |
RODEL, INC. |
发明人 |
COOK, LEE MELBOURNE;JAMES, DAVID B.;BUDINGER, WILLIAM D. |
| 分类号 |
B24B37/04;B24B57/02;(IPC1-7):H01L21/00 |
主分类号 |
B24B37/04 |
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