| 摘要 |
PROBLEM TO BE SOLVED: To provide an exhaust gas treating method in semiconductor manufacturing industry and a device for performing this method in which an accident such as an explosion on replacement work of treating material is prevented to remarkably improve the safety on the work concerning an exhaust gas treating method and device therefor in semiconductor manufacturing industry by, after the breakthrough or its vicinity of a catalyst or adsorbent (treating material) is reached, before the replacement of the treating material, shutting out formed material formed in a treating vessel. SOLUTION: When replacing treating materials filled into a treating vessel 6 into which exhaust gas in the semiconductor manufacturing industry is introduced, formed material formed in the treating vessel 6 is purged by compressed air or the like fed from a formed material purge device, and after that, the treating material 5 is replaced, thereby smoothly and safely performing the replacement of the treating material 5. |
