| 摘要 |
A method of applying dense adherent metal coatings on the surfaces of various materials (particles and substrates) including dielectrics, semiconductors and metals, is provided. The method utilizes solid-phase reactions. After degreasing and cleaning of the surface of materials, the particles of a compound chosen from the group of metals, alloys, metal oxides, metal hydroxides, metal sulfides are mechanically smeared on the surface of the material with a subsequent reducing of the compound in non-oxidizing atmosphere on heating to 200-500 DEG C. |
