摘要 |
PURPOSE: A method is provided for installing terminals on a circuit board to resolve the problems of reflow soldering. CONSTITUTION: A method for installing terminals comprises a coating step for coating solder paste(3) onto a desired circuit board(1), a superimposing step for superimposing a connecting end(4a) of a terminal(4) having a connecting end(4a) and non-connecting end(4b), and a step for heating and melting the solder paste in order that a connecting end(4a) is soldered to the circuit board(1). In the coating step, a plurality of mutually separate solder paste coated regions(3a-3d) are provided on the circuit board(1). In the superimposing step, a connecting end(4a) is superimposed such that it extends over a plurality of solder paste coated regions(3a - 3d). |