发明名称 METHOD FOR MOUNTING TERMINAL ON CIRCUIT BOARD AND CIRCUIT BOARD
摘要 PURPOSE: A method is provided for installing terminals on a circuit board to resolve the problems of reflow soldering. CONSTITUTION: A method for installing terminals comprises a coating step for coating solder paste(3) onto a desired circuit board(1), a superimposing step for superimposing a connecting end(4a) of a terminal(4) having a connecting end(4a) and non-connecting end(4b), and a step for heating and melting the solder paste in order that a connecting end(4a) is soldered to the circuit board(1). In the coating step, a plurality of mutually separate solder paste coated regions(3a-3d) are provided on the circuit board(1). In the superimposing step, a connecting end(4a) is superimposed such that it extends over a plurality of solder paste coated regions(3a - 3d).
申请公布号 KR20000011055(A) 申请公布日期 2000.02.25
申请号 KR19987009207 申请日期 1998.11.14
申请人 ROHM CO LTD 发明人 NAKAMURA SATOSHI
分类号 H05K1/11;H05K3/00;H05K3/34;H05K3/40;(IPC1-7):H05K3/34 主分类号 H05K1/11
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