APPARATUS AND METHOD FOR TREATING SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To prevent occurrence of transfer as an index of unevenness of a resist fluid film thickness and fluctuation of the line width of a circuit pattern. SOLUTION: The substrate treatment apparatus coats the substrate G with a resist and dries it before heating treatment, exposure treatment, and development treatment. This apparatus comprises a resist coating treatment unit 22 for coating the substrate G with the resist and a vacuum drying unit 40 for vacuum drying the coated substrate and an end-face treatment unit 23 for removing the resist attached to the end faces of the substrate G after the vacuum drying.