| 摘要 |
<p>PURPOSE: A process is provided to established electrically safe connection between two or more conductor structure with thermal method. CONSTITUTION: A conductor structures(2,4) are connected to a carrier(3) to form a conductor compound system. At least one of the conductor compound systems has openings(6) at the points of contact of the conductor structure in the region of which the connection is established by supplying thermal energy or by introducing an electrically conducting material. Thermal energy does not flow through a carrier but through a lead frame in a frame film with much energy to avoid a danger of melting the film.</p> |
