发明名称 |
CLAMP RING FOR FIXING WAFER |
摘要 |
<p>PROBLEM TO BE SOLVED: To fix a wafer effectively, and to prevent excess etching of a wafer outer edge by mounting a clamp ring body having an inside diameter smaller than the outside diameter of the wafer and covering the wafer outer edge and a plurality of square-shaped projections disposed at the inner edge of the clamp ring body. SOLUTION: A distance d3 between the inner edge of a clamp ring body 320 fixing the wafer 300 and the outer edge of the wafer 300 is set in approximately 1 mm. Consequently, the outer edge of the wafer 300 is covered completely, but an effective device region on the wafer 300 is not covered. One or two square-shaped projections 322 are disposed to the upper and lower and left and right sections of the inner edge of the clamp ring body 320 respectively while a distance d4 among the inner edge of the clamp ring body 320 and the front ends of the square-shaped projections 322 is set in approximately 1 mm. When the wafer 300 is fixed, an effective device region 302 is not covered because the square-shaped projections 322 are placed in a blank region 304 on the side outer than the effective device region 302 of the wafer 300.</p> |
申请公布号 |
JP2000058630(A) |
申请公布日期 |
2000.02.25 |
申请号 |
JP19980229195 |
申请日期 |
1998.08.13 |
申请人 |
PROMOS TECHNOL INC;MOSEL VITELIC INC;SIEMENS AG |
发明人 |
RI KINZUI;LIN SHIH-PO;KA KASHO;HAYASHI AKIHIRO |
分类号 |
H01L21/683;H01L21/306;H01L21/687 |
主分类号 |
H01L21/683 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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