| 摘要 |
PROBLEM TO BE SOLVED: To mount a GaN-family semiconductor light-emitting device in a flip-chip shape by fixing a base material to first and second lead frames, and at the same time electrically connecting first and second bonding pads to the first lead frame. SOLUTION: A light-emitting device is generally composed of a light- transmission base material 10, a light-emitting device 20, an adhesive layer 30, wires 40a and 40b, lead frames 50a and 50b and a sealing resin 60. One surface of the base material is provided with a pair of bonding pads 11a and 11b that is made of a conductive material. Also, a semiconductor element 20 is fixed to the base material 10. The base material 10 where the light-emitting device 20 is bonded is mounted to the pair of lead frames 50a and 50b where an external power supply is connected via the bonding pads 11a and 11b in a flip-chip shape. More specifically, the base material 10 is mounted to the lead frames 50a and 50b so that a substrate 21 of the light-emitting device 20 is directed to a main light emission direction. |
