SEMICONDUCTOR PACKAGING STRUCTURE, LIQUID CRYSTAL DISPLAY, AND ELECTRONIC EQUIPMENT

摘要

PROBLEM TO BE SOLVED: To reduce a cost and improve a reliability of a liquid crystal display device by improving its yield in manufacturing process of the same with always securing an enough connection area between a bamp of an IC chip and a substrate-side terminal. SOLUTION: An IC chip 4 provided by a plurality of bamps 7 is installed to a substrate 2b provided by a plurality of substrate-side terminals 6. At the time the IC chip is installed exactly to a standard installation position of the substrate 2b, a length of a substrate-side terminal 6b is extended so that a top end edge 6a of the substrate-side terminal 6b exceeds an end edge 7a of the bamp 7. This structure enables securing enough overlap between the substrate-side terminal 6b and the bamp 7, at the time the installation position of the IC chip facing to the substrate 2b is out of position in a lengthwise direction L1 of the substrate-side terminal 6b.