| 摘要 |
PROBLEM TO BE SOLVED: To realize a semiconductor manufacturing device which is provided with a heater that is easily mounted on a piping keeping high in adhesion to it by a method wherein at least a part of a piping provided in a semiconductor manufacturing device is wound with a spiral tubular heater so as to be lagged or heated. SOLUTION: A semiconductor manufacturing device 1 is equipped with a processing vessel 5 provided with a shower head 4 located above a semiconductor wafer 3, reactive gas that is vaporized passing through a piping heated by a spiral tubular heater 6 is introduced into the processing vessel 5, and hydrogen gas is mixed into the reactive gas passing through a piping 9 heated by a spiral tubular heater 8. The spital tubular heater is composed of an inner heat-resistant resin tape A wound on a shaping member which is of continuous length and the same shape with a piping, an intermediate adhesive layer, and an outer heat-resistant resin tape B, where a flexible resistor is provided in each end of one of them in a longer direction, and the intermediate adhesive layer is cured making the inner tape A overlap with the outer tape B in one piece.
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