发明名称 MILLIMETER WAVE SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a downsizable millimeter wave semiconductor device, having an electromagnetic sealed structure which displays good high frequency characteristics in an interior space sealed with a conductive cap to shield, is easily applicable to various packages for manufacturing various types of products because of a little high frequency characteristics change before and after the sealing, and does not need a long development time and a high cost. SOLUTION: A conductor formed on the surface of a seal cap 50 for sealing a millimeter device 30 mounted on a wiring board 10 has a ground potential. It is sealed so that the gap between the wiring board 10 and the inner surface of the seal cap 50 is less than a quarter wavelength of an applied frequency. This suppresses many waveguide modes at the applied frequency in the sealed space, whereby spurious electromagnetic waves propagating through this space can be lessened.
申请公布号 JP2000058691(A) 申请公布日期 2000.02.25
申请号 JP19980223848 申请日期 1998.08.07
申请人 SHARP CORP 发明人 KAKIMOTO NORIKO;SUEMATSU EIJI
分类号 H01L23/04;H01L23/02;H01L23/552;H01L23/66;H01L27/00;H01P5/08 主分类号 H01L23/04
代理机构 代理人
主权项
地址