发明名称 PGA PACKAGE
摘要 PROBLEM TO BE SOLVED: To make a structure approximate to a coaxial pin structure, enable control of impedance and reduce noise at the time of high speed signal propagation, by arranging a printed board for noise reduction which has through holes into which pins are inserted and a ground layer, between a printed board and a pin grid array. SOLUTION: A GND layer 4 in a PGA board 1 is connected with a GND layer 4 in a printed board 2 by using pins, and, at the same time, connected with a GND layer 4 in a board 3 for noise reduction by through hole plating for GND pins of the board 3 for noise reduction. FR4, polyimide, etc., may be used for material of the board 3 for noise reduction, and the thickness of the board 3 is slightly smaller than the length of the pins 7 of the PGA board 1. Since the board 3 for noise reduction is in contact with the GND pins, an inner layer is grounded. The inner layer keeps a clearance of a constant gap around a signal pin, and has a structure approximate to a coaxial pin. Thereby discontinuity in impedance is excluded at the parts of the pins 7, and generation of noise can be restrained.
申请公布号 JP2000058696(A) 申请公布日期 2000.02.25
申请号 JP19980225914 申请日期 1998.08.10
申请人 NEC CORP 发明人 SUYAMA TAKAYUKI
分类号 H01L23/12;H05K1/18;(IPC1-7):H01L23/12 主分类号 H01L23/12
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