发明名称 CARRIER TAPE WITH REINFORCING SECTION AND SEMICONDUCTOR DEVICE USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a carrier tape which can prevent the occurrence of troubles when tape BGAs(ball grid arrays) manufactured in a reel-to-reel system and carried on the tape are handled due to the warping of the substrates of the BGAs after the BGAs are separated into individual BGAs, and can make the BGAs to be easily handled when the BGAs are carried or assembled in various kinds of electronic equipment in an assembling process. SOLUTION: A picture frame-like reinforcing section is formed of one metallic tape of a carrier tape consisting of an insulating film and at least two or more metallic layers, and a wiring section 2 is formed of the other metallic layer. The metallic layers and an insulating layer 1 are constituted without using any adhesive material in such a way that the insulating layer 1 is provided in at least the wiring section 2 of the outermost wiring layer except electrode pad portions 3, and a via hole 5 is provided inside the frame-like reinforcing section from the insulating film side, and then, constituting the reinforcing section to have the same strength as a lead frame has.
申请公布号 JP2000058701(A) 申请公布日期 2000.02.25
申请号 JP19980221864 申请日期 1998.08.05
申请人 SUMITOMO METAL MINING CO LTD 发明人 MITSUNARI NAOHITO
分类号 H01L23/12;H01L21/60;(IPC1-7):H01L23/12 主分类号 H01L23/12
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