DIE BONDING ADHESIVES FOR MICRO ELECTRONIC EQUIPMENT

摘要

PURPOSE: The adhesive compositions for micro electronic equipment or semiconductor package are provided which can be used for die bonding. CONSTITUTION: The adhesive compositions for micro electronic equipment comprise not less than one maleimide compounds having polyfunctional or monofunctional group, or not less than one vinyl compounds having polyfunctional or monofunctional group, or mixtures of maleimide compounds and vinyl compounds, and hardening initiator and/or not less than one filler. These adhesives are satisfied with the adhesive strength and the flexibility, and are also reworkable.