| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method by which a highly reliable flat semiconductor device can be realized at a low cost. SOLUTION: A semiconductor device is constituted by incorporating at least one or more semiconductor elements 1 having at least first main electrodes 4 on first main surfaces, and second main electrodes 5 on second main surfaces in a flat package. In the flat package, a pair of main electrode plates exposed on both surfaces are electrically insulated from each other by means of an insulating outer casing. The outer peripheral surface parts of the semiconductor elements 1 which are not faced to intermediate electrode plates 2 and 3 and at least parts of the side faces of the electrode plates 2 and 3 are compactly sealed with an electrical insulating material 6. Therefor, the manufacturing cost of a flat type semiconductor device can be reduced without spoiling the reliability of the device.</p> |
