发明名称 MATERIAL AND METHOD FOR PACKAGING WAFER
摘要 <p>PROBLEM TO BE SOLVED: To make the identification marks of wafers confirmable, while the wafers are housed in a container in a packed state and to make the wafers easy to take out of the container, and at the same time, to facilitate wafer packaging materials to be separated one by one. SOLUTION: A wafer packaging material composed of a main body having nearly the same area and shape as those of one surface of a wafer and tags (extended pieces) provided in a state that the tags are extended outward from the peripheral edge of the main body is used. In a container 10, plural wafers and wafer packing materials are arranged alternately, with the wafers being arranged in horizontal states. At the time of arranging the wafers and wafer packing materials in the container 10, the numbers P of the wafers are marked on the front end sides of the tags of wafer packing materials, and the tags are arranged upward along the internal surface of the container 10 in such a way that the tags do not overlap each other. Then a cushioning material 11 is put on the uppermost wafer with one wafer packing material in between, and thereafter, the front end sides of the tags of the wafer packing materials are arranged on the upper surface of the cushioning material 11.</p>
申请公布号 JP2000058632(A) 申请公布日期 2000.02.25
申请号 JP19980230486 申请日期 1998.08.17
申请人 SONY CORP 发明人 DOUCHI TAKESHI
分类号 B65C7/00;B65D85/86;H01L21/673;H01L21/68;(IPC1-7):H01L21/68 主分类号 B65C7/00
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