发明名称 SUBSTRATE HEATING METHOD AND EQUIPMENT THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a substrate heating method and equipment, which can prevent decrease of temperature until a heated substrate is transferred to a treatment chamber and transfer the substrate to the treatment chamber at an accurate heating temperature. SOLUTION: In this substrate heating method, a substrate transfer robot 3 for transferring a substrate 11, in which a hand 10 holding the substrate 11 at the tip is fixed on the tip of an arm 9 is arranged in a load lock chamber 1. A heater unit 2 having a lamp heater 4, which heats the substrate 11 from above the outside of the load lock chamber 1, when the substrate 11 mounted on the hand 10 is transferred in the load lock chamber 1 is arranged. The substrate 11 transferred in the load lock chamber 1 is heated from above the outside of the load lock chamber 1. The substrate 11 is rapidly introduced into a treatment chamber after heating.
申请公布号 JP2000058455(A) 申请公布日期 2000.02.25
申请号 JP19980221770 申请日期 1998.08.05
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 MIYAKE KIYOO;SAWADA KAZUYUKI;ARAI YASUSHI;SUZUKI NAOKI
分类号 C23C16/46;C23C16/50;H01L21/205;H01L21/26;(IPC1-7):H01L21/205 主分类号 C23C16/46
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