发明名称 IMPREGNATED ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To enhance oil-leakage prevention effect in resin layers for coverage of a composite electronic component part by using urethane thermosetting resin, which can maintain liquid resin state with viscosity lower than a specified value under a specified temperature condition for a specified duration of time. SOLUTION: An impregnated electronic component contains an electronic component part 4 which is impregnated with oil in its outer case 5 having an opening on a face, then is covered by a resin layer 1 and is further covered by a resin layer 2 on the resin layer 1. The resin layer 1 is a urethane-resin having oil absorptivity, capable of maintaining liquid state with viscosity of 50 poises lower under 50 deg.C ambience for 10 minutes, and having hardness of D-40 (23 deg.C) per ASTM/D-2240. The resin layer 2, which covers the resin layer 1, is a urethane-resin having hardness of D-50 (23 deg.C). Outer electrode 3 are covered by the resin layer 1 on its surface contacting the resin layers with an embedded ratio of 80%. As a result, an electronic component having of non-deteriorated breakdown strength characteristic is obtained without causing deterioration in of the adhesion between the outer electrodes and the filled resin.
申请公布号 JP2000058371(A) 申请公布日期 2000.02.25
申请号 JP19980293511 申请日期 1998.10.15
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 KAMIYA MICHIHARU;TAKAHASHI NAOKI;YAMADA KENJI;ICHIIE TOSHIFUMI
分类号 H01G4/22;(IPC1-7):H01G4/22 主分类号 H01G4/22
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