发明名称 LEAD FRAME AND MANUFACTURE THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a lead frame together with its manufacturing method for effective use of palladium and improved work speed. SOLUTION: A tape material 10A with a pre-formed opening is pasted to regions corresponding to a surface tip-end part 3A of a inner lead part 3 and front/rear surface of an outer lead part 4, which is submerged in a palladium molten plating bath, so that a partial plating coat of palladium is formed at the surface tip-end part 3A of the inner lead part 3 and the front/rear surface of the outer lead part 4 at the same time. Thus, effective use of palladium is encouraged while efficiency of partial plating work is raised.
申请公布号 JP2000058730(A) 申请公布日期 2000.02.25
申请号 JP19980219939 申请日期 1998.08.04
申请人 SONY CORP 发明人 MINAMI TOSHIHIKO
分类号 C25D5/02;H01L23/50;(IPC1-7):H01L23/50 主分类号 C25D5/02
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