摘要 |
PURPOSE: A semiconductor device is provided to be able to control a bonding band to have a specific capacity without needing large area, increasing the manufacturing process and elongating the delay time of the input signal. CONSTITUTION: The semiconductor device is composed of: an input/output unit for inputting and outputting the signal; an inner circuit unit for receiving the inputted signal to the input/output unit or outputting the signal through the input/output unit; a first protection resistance provided on the signal transmission line between the input/output unit and the inner circuit unit to protect the inner circuit unit; a capacity unit including the capacity connected to the input/output unit, and having plural insulating gate field effect transistors or plural MOS capacity devices; a second protection resistance connected between the input/output unit and the capacity unit to protect the capacity unit; and the capacity unit and the second protection resistance are provided on an additional conducting wire from the signal transmission line.
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