发明名称 SLURRY RECOVERING METHOD AND SLURRY RECOVERING DEVICE
摘要 PROBLEM TO BE SOLVED: To facilitate the removal of slurry in a washing liquid to prolong the life of the washing liquid and a circulating pump when recovering cutting oil slurry containing wire worn powder from a wafer washing liquid by separating and recovering the slurry in the wafer washing liquid from the wafer washing liquid by magnetic attraction. SOLUTION: In cutting oil sludge in washing liquid in a wafer washer for washing silicon ingots cut by a wire saw, silicon cut powder, wire worn powder, and cutting freed abrasive grains are included. Then, as a slurry recovering device, a washing liquid storage tank 21 is provided, attached to a silicon ingot cutting device. This storage tank 21 is provided with a circulating route 23 for circulating washing liquid by a pump 22. And a part of the washing liquid flowing into the storage tank 21 is branched from the circulating route 23 and is jetted and caused to flow into the storage tank 21 through a jetting nozzle 24. The storage tank 21 is provided with a magnet 25 in the bottom part thereof to attract and stick iron powder contained in the slurry to it, and the magnet is periodically taken out to remove the slurry.
申请公布号 JP2000051734(A) 申请公布日期 2000.02.22
申请号 JP19980225514 申请日期 1998.08.10
申请人 SUGINO MACH LTD 发明人 MURATSUBAKI RYOJI;NISHIDA NOBUO;KANEMITSU MASANORI;YAMAGISHI NOBUTAKA;KAMEDA YUJI;KANAYAMA TADASHI
分类号 B03C1/00 主分类号 B03C1/00
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