TRUING DEVICE FOR WAFER POLISHING PAD

摘要

PROBLEM TO BE SOLVED: To provide a truing device for a wafer polishing pad capable of stably truing a polishing pad by abutting a truing grinding wheel in parallel to the polishing pad. SOLUTION: A truing device 1 is provided with a truing grinding wheel part 2 having an abrasive grain layer 2a and a grinding wheel part supporting mechanism 5 for tiltably, turnably supporting the truing grinding wheel part 2. The truing grinding wheel part 2 is rotated by friction against a polishing pad 31 evolved by the rotation of the polishing pad 31. An abutting angle between the truing grinding wheel part 2 and the polishing pad 31 is controlled by an abutting angle controlling means having an arm rocking mechanism 7 and a rotating speed detecting means 9. The result stably trues the polishing pad 31.