发明名称 VACUUM JOINT MECHANISM
摘要 <p>PROBLEM TO BE SOLVED: To provide a vacuum joint mechanism capable of surely connecting a shell and an evacuator to each other even if a contactor, a wafer and the integrated article (shall) of a wafer holder are automatically loaded in a testing chamber, and surely performing stable reliability testing. SOLUTION: A vacuum joint mechanism 10 is adapted to connect a vacuum joint 11 to the valve mechanism 33 of a shell 30 having a wafer W and a contactor adsorbed by vacuum on a wafer chuck when reliability testing is performed, and provided with an air cylinder 12 for advancing the vacuum joint 11, a positioning member 13 adapted to advance together with the vacuum joint 11 through the air cylinder, a guiding member 14 operated in cooperation with the positioning member 13 to guide the vacuum joint 11 to the connecting position of the value mechanism 33, a guide rail 15 for moving and guiding the air cylinder 12 around the wafer chuck and in its peripheral direction through the guiding member 14 while the positioning member 13 advances, and a pair of pogo pins 16 and 16 for returning the air cylinder 12 moved by the guiding rail 15 to a neutral position.</p>
申请公布号 JP2000052159(A) 申请公布日期 2000.02.22
申请号 JP19990149247 申请日期 1999.05.28
申请人 TOKYO ELECTRON LTD 发明人 YONEZAWA TOSHIHIRO;TSUKADA HIROSHI
分类号 B23P19/00;(IPC1-7):B23P19/00 主分类号 B23P19/00
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