发明名称 IC SOCKET
摘要 PROBLEM TO BE SOLVED: To cancel imperfect restoring displacement of elastic contact pieces in restoring a moving plate with the elastic contact pieces of contacts and thereby securely press and abut contacts on the external contacts of an IC package in the case that a guiding part to guide the loading of the IC package is integrally formed with a moving plate and the moving plate is laterally moved to open and close the contacts. SOLUTION: In an IC socket wherein a contact releasing state from external contacts 7 of an IC by displacing elastic contact pieces 4, 4' of contacts 3 formed in a socket body 1 in one direction against elasticity by means of the one-directional lateral movement of a moving plate 2, and a contact state is formed by laterally moving the moving plate 2 in the other direction by the displacement of the elastic contact pieces 4, 4' by their restoring force, and abutting the elastic contact pieces 4, 4' on the external contacts 7, a guiding member 8 to regulate the side surface of an IC package 6 mounted on the upper surface of the moving plate 2 to define its mounting position is formed and the guiding member 8 is so formed as to be laterally movably in the displacement direction of the elastic contact pieces 4, 4' with respect to the moving plate 2.
申请公布号 JP2000048923(A) 申请公布日期 2000.02.18
申请号 JP19980213661 申请日期 1998.07.29
申请人 YAMAICHI ELECTRONICS CO LTD 发明人 ABE SHUNJI;KAWAMURA NOBUO
分类号 H01R33/76;H01L23/32;H01R13/64;(IPC1-7):H01R33/76 主分类号 H01R33/76
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