发明名称 ULTRASONIC FLAW DETECTING DEVICE
摘要 PROBLEM TO BE SOLVED: To enable the reduction of operations such as the cutting and removal of defect-detected parts which lower production efficiency by specifying the radial location of defects in the vicinity of a surface layer detected in a material to be inspected and performing automatic grinding by a grinder, etc. SOLUTION: An origin mark 23 is applied to a material 1 to be inspected to detect one rotation of the material 1. An origin mark sensor 24 detects the origin mark 23 in a non-contact way. An origin pulse generating device 25 transmits an origin pulse, which is to be a reference signal, while the origin mark sensor 24 is detecting the origin mark 23. A fixed-multiplication pulse generating device 26 creates a 1/48-cycle pulse from the origin pulse transmitted from the origin pulse generating device 25. A map processing device 27 performs resolution processing on a radial defect location from a signal transmitted from the fixed-multiplication pulse generating device 26 and a flaw detection processing signal from a flaw detection processing device 15. An automatic grinder processing device 28 receives map information on the results of flaw detection from the map processing device 27 and edits information on grinding by a grinder.
申请公布号 JP2000046806(A) 申请公布日期 2000.02.18
申请号 JP19980216932 申请日期 1998.07.31
申请人 MITSUBISHI ELECTRIC CORP;KAWASAKI STEEL CORP 发明人 ISHIKAWA TAKAAKI;TANAKA HIROTSUGU;TAKEHISA OSAMU
分类号 G01N29/04 主分类号 G01N29/04
代理机构 代理人
主权项
地址