CHIP RESISTOR

摘要

PROBLEM TO BE SOLVED: To obtain a chip resistor which can prevent peeling of a plated layer. SOLUTION: First electrodes of a glazed metal base are formed on the front surface of a substrate 2, and second electrodes of a glazed metal base is formed on the rear surface of the substrate 2. A resistor 3 is formed between the paired first electrodes and covered with a glass coat, and the glass coat is covered with a resin coat. The resin coat and a pair of third electrodes are formed in such a way that the first and second electrodes formed of the glazed metals are exposed in part. Then a plated layer is formed to also cover the exposed parts of the first and second electrodes. Then the first and second electrodes become as anchors for a plated layer and prevent the peeling of the plated layer.