发明名称 MULTI-PROBE TEST HEAD AND TEST METHOD
摘要 In a test head for a scanning probe microscope for the contactless testing of integrated electronic circuits, a group of probes produced by three-dimensional additive lithography is disposed on a substrate. The probes are directed at a point situated centrally above the group of probes. The conducting probes as well as the base end of the capacitive probe are joined to printed circuit trace structures on the substrate for connection to a test circuit.
申请公布号 EP0979414(A1) 申请公布日期 2000.02.16
申请号 EP19990903611 申请日期 1999.01.08
申请人 DEUTSCHE TELEKOM AG 发明人 KOOPS, HANS, W., P.
分类号 G01R1/06;G01B7/34;G01Q30/02;G01Q60/02;G01Q60/16;G01Q60/22;G01Q60/38;G01Q60/40;G01Q60/48;G01Q60/54;G01Q70/10;G01R1/067;G01R1/07;G01R31/26;G01R31/302;H01L21/66 主分类号 G01R1/06
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