摘要 |
PROBLEM TO BE SOLVED: To obtain a measuring method in which the temperature of the junction part of an IC being operated can be measured. SOLUTION: A plurality of sockets 5 for testing and a socket 11 for temperature measurement are installed on a board 4. An IC to be tested and an IC for temperature measurement are attached respectively to the sockets 5, 11 on a DUT board 1' on which input terminals Fc, Fv and terminals Sv, Fv, for voltage measurement, which are connected to power-supply pins and input pins of the socket 11 for temperature measurement are installed. Then, the IC to be tested is connected to a testing apparatus so as to make a test, a current source 12 for measurement is connected to the input terminals Fc, Fv, and an amplifier 13 for measurement is connected to the terminals Sc, Sv for voltage measurement. A measuring current is made to flow to the input protective diode of the IC, for temperature measurement, attached to the socket 11, for temperature measurement, from the current source 12 for measurement so as to be in the forward direction, A voltage at this time is measured. Thereby, the temperature of the junction part of the IC, to be tested, being operated can be measured.
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