发明名称 HEAT TREATMENT APPARATUS FOR LEAD FRAME, HEAT TREATMENT OF LEAD FRAME AND APPARATUS FOR PRODUCTION OF LEAD FRAME
摘要 PROBLEM TO BE SOLVED: To obtain an apparatus for production of lead frames capable of producing the lead frames by continuing the respective treatments from pressing to a plating treatment. SOLUTION: This heat treatment apparatus 12 for the lead frame 16 is provided with single rollers 26 heated at their outer peripheral surfaces to prescribed temp. within a heating chamber 22 for heat treating the belt-like lead frame 16 during traveling successively along the traveling direction of the lead frame 16. The respective rollers 26 are so disposed that the surfaces of the lead frame 16 and the outer peripheral surfaces of the respective rollers 26 come successively into contact with each other. The apparatus continuously transports the belt-like lead frame 16 obtd. by pressing a belt-like metallic material and heat treats the lead frame during traveling, thereby relieving the internal residual strains born by the lead frame 16.
申请公布号 JP2000038620(A) 申请公布日期 2000.02.08
申请号 JP19980209759 申请日期 1998.07.24
申请人 SHINKO ELECTRIC IND CO LTD 发明人 HARADA TAMOTSU;NAKAZAWA KIYOSHI;BABA YASUHIRO
分类号 C21D1/74;C21D9/56;H01L23/50;(IPC1-7):C21D9/56 主分类号 C21D1/74
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