| 摘要 |
PURPOSE: A multi-shape apparatus of a semiconductor chip molding press is provided to cut down production cost and enhance product quality by not using a large-scaled pressure cylinder and a pressure valve or greatly reducing the number of pressure valves. CONSTITUTION: The semiconductor molding press a switch contact pausing an ascending operation of a pressure cylinder for a while; a clamping piston moving into a casing by hydraulic supply during pause of the pressure cylinder; pressure bars fixed to a right side and a left side of a bottom of a driving plate, respectively; a clamp chuck clamping the pressure bar; a pressure sensor sensing the clamping of the chuck to be operated; a pressure piston coupling a lower molding to an upper molding by reascending the driving plate.
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