COMPRESS-FORMING METHOD

摘要

PURPOSE: A forming method by compressing is provided to pattern into a fine shape to possibly apply to the manufacturing process of semiconductors and electronic products by preventing the high molecular substance with its design printed from being torn off adhered to the surface of a mold substrate. CONSTITUTION: The forming method by compressing of the fine shape comprises the steps of: heating any side of a mold substrate(9) or a high molecular material sample(10); forming by compressing the mold substrate(9) and the high molecular sample(10); and cooling the heated substrate after a specific time and separating the high molecular material sample(10) and the mold.